CHIP ON BOARD

ENABLES PRECISION IN THE SMALLEST SPACES

RAFI Eltec has over 20 years of experience in the special technology chip-on-board. That gives us a profound understanding of processes and quality in the standard technologies and beyond. As a result, we meet your requirements for flexible and reliable implementation of technically sophisticated solutions. We even set new standards.

 

CHIP-ON-BOARD TECHNOLOGIES

  • Chip-on-board bonding
  • Chip-on-chip bonding
  • Chip-on-flex bonding
  • Flip chip

TECHNOLOGIES IN THE CLEAN ROOM

  • Die bonding
  • Wire bonding (aluminum wire bonding and gold wire wedge-wedge bonding)
  • Glob top casting
  • Optical casting
  • Application of HF seals

Casting

Wire bonding

YOUR CONTACT

Rafi Eltec GmbH
Im Langäcker 1,
D-88662 Überlingen
Tel.: +49 7551 80000